Tungsten Sputtering Target

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Description of Tungsten Sputtering Target:

Of all metals in pure form, tungsten has the highest melting point (3422℃, 6192 ℉), lowest vapor pressure (at temperatures above 1650℃, 3000 ℉) and the highest tensile strength. Although carbon remains solid at higher temperatures than tungsten, carbon sublimes at atmospheric pressure instead of melting, so it has no melting point. Tungsten has the lowest coefficient of thermal expansion of any pure metal. The low thermal expansion and high melting point and tensile strength of tungsten originate from strong covalent bonds formed between tungsten atoms by the 5d electrons. Alloying small quantities of tungsten with steel greatly increases its tou.


Description of Tungsten Sputtering Target:

Purity: W>99.95%
Density: >19.1g/cc
Circular: Diameter <= 14inch, Thickness >= 1mm
Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm
Types: Planar & Rotary Tungsten sputtering targets


Application of Tungsten Sputtering Target:

Tungsten sputtering target can be applied in vacuum coating industry, X ray tube, ion sputtering, flat panel display industry and photovoltaic industry. Tungsten sputtering target can be used as thin-film solar cell electrode, wiring material and barrier layer material of semiconductor.

Specification of Tungsten Sputtering Target:

Below are most of the standard sizes for our tungsten sputtering targets. If you do not see the size that you need, please feel free to contact us.
Thickness Width Length Parallelism Verticality Surface finish
8.0~16.0 10~450 10~500 <0.05 <2o <Ra0.8
3.0~8.0 10~450 10~800 <0.05 <2o <Ra0.8
1.0~3.0 10~450 10~1200 <0.05 <2o <Ra0.8
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