Lead Titanate (PbTiO3) Sputtering Targets

InquiryData sheet
Applications
•  Ferroelectric
• Gate Dielectric
• For CMOS


Features
• High purity
• Custom Sizes Available


Manufacturing Process
• Manufacturing - Cold pressed - Sintered, Elastomer bonded to backing plate
• Cleaning and final packaging, Cleaned for use in vacuum,
Protection from environmental contaminants
Protection during shipment


Options
• 99.9% ex Strontium Minimum Purity
•Up to 12'' Diameter Targets Available
•Planar Tiles Up to 8'' X 5'' for Larger Target Configurations
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