Nitride Targets

  • Aluminum Nitride (AlN) Sputtering Targets
    What is Aluminium Nitride (AlN) Aluminium nitride (AlN) is an interesting material and is one of the best materials to use if high thermal conductivity is required. When combined with its excellent electrical insulation properties, aluminium nitride is an ideal heat sink material for many electrical
  • Boron Nitride (BN) Sputtering Targets
    General Boron nitride is a heat- and chemically resistant refractory compound of boron and nitrogen with the chemical formula BN. It exists in various crystalline forms that are isoelectronic to a similarly structured carbon lattice. The hexagonal form corresponding to graphite is the most stable an
  • Chromium Nitride (CrN) Sputtering Targets
    Chromium nitride is a chemical compound of chromium and nitrogen with the formula CrN. It is very hard, and is extremely resistant to corrosion. CrN is used as a coating material for corrosion resistance and in metal forming and plastic moulding applications. CrN is often used on medical implants an
  • Hafnium Nitride (HfN) Sputtering Targets
    Hafnium nitride (HfN x ) coatings were prepared via very high rate reactive sputtering in an Ar=N 2 atmosphere over a wide range of nitrogen concentrations. The color of the coatings varied from a pale yellow at low nitrogen levels to a rich golden yellow color at the higher nitrogen levels.AEM spec
  • Niobium Nitride (NbN) Sputtering Targets
    Niobium nitride is a compound of niobium and nitrogen (nitride) with the chemical formula NbN. At low temperatures (about 16 K) NbN, niobium nitride becomes a superconductor, and is used in detectors for infrared light. Niobium nitride is a compound of niobium and nitrogen (nitride) with the chemica
  • Silicon Nitride (Si3N4) Sputtering Targets
    Silicon nitride is a chemical compound of the elements silicon and nitrogen, with the formula Si3N4. It is a white, high-melting-point solid that is relatively chemically inert, being attacked by dilute HF and hot H2SO4. It is very hard (8.5 on the mohs scale). It is the most thermodynamically stabl
  • Tantalum Nitride (TaN) Sputtering Targets
    Tantalum nitride (TaN) is an inorganic chemical compound. It is sometimes used to create barrier or glue layers between copper, or other conductive metals, and dielectric insulator films such as thermal oxides. These films are deposited on top of silicon wafers during the manufacture of integrated c
  • Titanium Nitride (TiN) Sputtering Targets
    Titanium nitride (TiN) (sometimes known as tinite) is an extremely hard ceramic material, often used as a coating on titanium alloys, steel, carbide, and aluminium components to improve the substrates surface properties. Material Notes Titanium Nitride Sputtering Target, Purity is 99.5%; Circular: D
  • Zirconium Nitride (ZrN) Sputtering Targets
    Zirconium nitride (ZrN) is an inorganic compound used in a variety of ways due to its properties.ZrN grown by physical vapor deposition (PVD) is a light gold color similar to elemental gold. ZrN has a room-temperature electrical resistivityof 12.0cm, a temperature coefficient of resistivity of 5.610
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